Изготовление PCB
(4)
3 милли 4 милли 3-8 унций производитель HDI ПХБ 1-28 слоев
Цена: negotiable
MOQ: Negotiable
Срок поставки: Negotiable
Бренд: Yuetong
Выделять:3oz PCB Board Manufacturer, 8oz PCB Board Manufacturer, 3mil pcb assembly services
HDI PCB Printed Board HDI PCB Printed Board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces and higher connection pad density than employed in conventional PCB technology. HDI board is used to re... Посмотреть больше
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8 слоев многослойный HDI ПКБ FR4 1,6 мм TG 180 1 OZ
Цена: negotiable
MOQ: Negotiable
Срок поставки: Negotiable
Бренд: Yuetong
Выделять:8 Layer HDI PCB Board, FR4 HDI PCB Board, 1.6mm hdi pcb manufacturer
Multilayer HDI PCB Board Multilayer HDI PCB Board supplier is providing Quick Turn PCB Prototype Manufacturing services, Low and Medium-volume Printed Circuit Board Manufacturing services. We solemnly do commitment to you, on time delivery, especially the Quick Turn PCB Prototypes 100% on time deliv... Посмотреть больше
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Высокая плотность многослойная плата для медицинских устройств
Цена: negotiable
MOQ: Negotiable
Срок поставки: Negotiable
Бренд: Yuetong
Выделять:High Density Multilayer Circuit Board, Phone Multilayer Circuit Board, Medical Devices circuit board manufacturing
High Density Multilayer Printed PCB For Phone HDI design requires the latest advances in the PCB interconnection technology: With the latest state of the art PCB technology, HDI PCBs can be defined as those printed circuit boards that make use of some or all of the following features; Blind and buri... Посмотреть больше
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8 слоев ENIG HDI ПКБ Планшеты изготовления
Цена: negotiable
MOQ: Negotiable
Срок поставки: Negotiable
Бренд: Yuetong
Выделять:8 Layers PCB Fabrication, HDI PCB Fabrication, PCB Circuit Board Fabrication
HDI PCB fabrication is rapidly becoming the ultimate solution for smaller, more efficient, and more durable PCBs. High-Density Interconnect (HDI) is a high-performance design that is characterized by its high density of components and routing Interconnections that use micro vias, blind and buried vi... Посмотреть больше
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